Grid Conductive Anti-Static Bag / Transparent Grid ESD Shielding Bag

I. Core Material & Process（Technical Details）

1. Base Material

Raw Material Composition

Adopts food-grade / electronic-grade brand-new blended base material of Low Density Polyethylene (LDPE) and Linear Low Density Polyethylene (LLDPE), with no recycled materials added and high purity.

Key Characteristics

• Excellent low-temperature resistance, maintaining good flexibility without cracking even at -40℃.

• Puncture resistance ≥ 3N, able to withstand piercing impact from sharp pins and component edges.

• Transparency ≥ 85%. Combined with grid design, it does not affect product appearance and model identification.

2. Conductive Grid Layer

Conductive Medium

Adopts composite system of nano conductive carbon black / carbon fiber and conductive ink. A uniform black conductive grid path is formed by precision printing technology.Structural PrincipleGrid line width: about 0.5~1mm; grid spacing: 5~10mm. It forms a continuous static discharge network to ensure stable resistance between any two points on the bag surface. Performance Advantages

• The conductive ink features strong adhesion, not easy to fall off by friction or bending, and the conductive performance will not decay.

• Grid printing does not affect the sealing performance of the bag, and the moistureproof & dustproof functions remain intact.

3. Production Process

Film Blowing Process

Adopts multi-layer co-extrusion film blowing technology with uniform material thickness and tolerance ≤ ±0.01mm, ensuring consistent anti-static performance.

Printing Process

Printed with eco-friendly water-based conductive ink, no solvent residue, compliant with RoHS and REACH standards.

Bag Making Process

High-frequency heat sealing / hot cutting bag making. Sealing strength ≥ 15N/15mm, airtight and leakproof, capable of bearing conventional transportation pressure.

II. Key Performance Parameters

Surface Resistance：Stably maintained at 10³~10⁶ Ω/, quickly dissipating static electricity and preventing charge accumulation

Transparency：Transparent bag body with black grid, clear internal visibility for easy inventory and quality inspection

Physical Protection：Moistureproof, dustproof, tear-resistant and puncture-resistant, protecting products from moisture and dust damage

Environmental Standard：Compliant with RoHS & REACH standards, heavy metal-free, recyclable, suitable for export products

III. Core Functions & Advantages

Dual Anti-Static Protection

·The conductive grid layer releases static electricity rapidly; the transparent base material isolates external electrostatic fields, avoiding ESD damage to electronic components.

Visual Management

·Transparent bag body with grid design allows checking product model and appearance without opening the bag, greatly improving warehouse management and quality inspection efficiency.

Durable & Reliable

·Good toughness, tear resistance and high durability. Strong sealing performance with stable moistureproof and dustproof effect.

Customization Available

·Customizable size, thickness and sealing type (flat mouth / self-adhesive / zipper). Support printing of logo, warning marks and product information.

IV. Application Scenarios & Workplace

Electronic Manufacturing: Production and turnover of chips, PCB circuit boards, connectors, capacitors, resistors and other electronic components

Precision Instruments: Anti-static packaging for precision sensors, optical lenses and medical electronic accessories

Warehousing & Logistics: Storage, transportation and courier packaging of ESD-sensitive products, preventing static damage and collision damage

Cleanroom:Storage and transfer of static-sensitive equipment and accessories in laboratories and cleanrooms

V. Extended Core Functions & Advantages

1. Triple Anti-Static Protection System

First Layer: Surface Static DissipationThe conductive grid quickly discharges friction static on the bag surface, avoiding dust adsorption and electrostatic field formation.

Second Layer: Internal Static IsolationHigh-insulation PE base material isolates external electrostatic fields and prevents induced static electricity of internal products.

Third Layer: Electrostatic ShieldingThe continuous grid structure weakens external Electromagnetic Interference (EMI) and protects sensitive circuits from interference.

2. Visual Anti-Static Management

The transparent body with black grid allows direct observation of product model, appearance and pin status without unpacking, improving efficiency in warehousing, inspection and inbound & outbound management.

Custom printing of anti-static warning marks, product models and batch numbers is available for product traceability.

3. Full-Scenario Physical Protection

Moistureproof & DustproofWater vapor transmission rate of PE material ≤ 5g/(m²·24h), isolating moisture and dust to avoid oxidation of metal pins and short circuit caused by dampness.

Scratch & Drop ResistanceGood flexibility cushions slight collision and reduces appearance abrasion during transportation.

Chemical Corrosion ResistanceCertain tolerance to daily electronic industry cleaners and flux fumes, not easy to corrode and age.

4. Long-Term Performance Stability

The conductive ink adopts weather-resistant formula with UV resistance and aging resistance. The anti-static performance remains stable for more than 3 years under normal storage environment.

Not affected by ambient humidity. It maintains stable static discharge even under low humidity (20% RH), avoiding the common defect of ordinary anti-static bags losing efficacy in dry conditions.

VI. Usage & Storage Precautions

·Check the bag before use to ensure no damage and no falling-off of the conductive grid; do not use invalid bags.

·Store in dry and ventilated environment with temperature 15~30℃ and humidity 40%~60%; avoid direct sunlight.

·Keep away from sharp objects and chemicals to prevent piercing and corrosion.

·Use up the bags after opening as soon as possible; seal the remaining bags properly to avoid moisture affecting performance.